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NTI Nanofilm Showcases Thin-Film Coating Solutions at SEMICON Southeast Asia 2025

NTI Nanofilm participated in SEMICON Southeast Asia 2025, held at Marina Bay Sands, Singapore, from May 20 to 22. The exhibition provided an opportunity for NTI Nanofilm to engage with customers, business partners, and industry professionals across the semiconductor and advanced manufacturing sectors.

Event Participation at SEMICON Southeast Asia 2025

Over three days, NTI Nanofilm’s team presented its proprietary Filtered Cathodic Vacuum Arc (FCVA) coating technologies, highlighting applications across backend semiconductor packaging and multiple industries. The booth attracted consistent visitor traffic from both existing partners and new prospects seeking solutions for process challenges in backend manufacturing.

NTI Nanofilm team at SEMICON Southeast Asia 2025 booth showcasing FCVA thin-film coating technologies for semiconductor backend packaging and advanced manufacturing applications.

Thin-Film Coating Solutions for Backend Semiconductor Packaging

Visitors explored NTI Nanofilm’s thin-film coating solutions including TAC-ON®, MiCC®, and ASD coatings. Discussions focused on how these technologies help address common backend process issues such as tool wear, ESD sensitivity, adhesion performance, and chemical attack, contributing to improved yield stability, extended tool life, and reduced downtime.

Applications Across Multiple Industries

Beyond semiconductor applications, NTI Nanofilm’s coating technologies also support industries such as consumer electronics, automotive, e-mobility, optics, renewable energy, homeware, luxury goods, textiles, and medical devices.

FCVA Technology Presentation at TechStage

In addition to booth activities, NTI Nanofilm participated in the event’s TechStage conference. Dr. Jacob, Scientist at NTI Nanofilm, delivered a presentation on how FCVA-based thin-film coatings contribute to semiconductor backend packaging by addressing process stability, ESD protection, contamination risks, and wear challenges. The session was well attended by visitors interested in advanced semiconductor packaging solutions.

techstage semicon
Dr. Jacob from NTI Nanofilm presenting at SEMICON Southeast Asia 2025 TechStage on FCVA-based thin-film coatings for backend semiconductor packaging, addressing wear, contamination, and ESD challenges.

Strengthening Customer Collaborations

Throughout the event, NTI Nanofilm conducted multiple discussions on technical collaborations, customer challenges, and process improvement opportunities. The exhibition served as a platform to strengthen existing partnerships and initiate new dialogues for future cooperation.

NTI Nanofilm technical specialists engaging with visitors at SEMICON Southeast Asia 2025, discussing coating solutions for tool wear, ESD protection, adhesion performance, and backend process improvements.

Upcoming Industry Events

Following SEMICON Southeast Asia 2025, NTI Nanofilm continues to expand its international engagement through upcoming participation at:

  • Tribology Conference 2025 Spring (Tokyo, Japan)
  • SNEC PV Power Expo 2025 (Shanghai, China)
  • Manufacturing Expo 2025 (Bangkok, Thailand)
  • Laser World of Photonics 2025 (Munich, Germany)

NTI Nanofilm remains focused on providing thin-film coating solutions that meet the operational needs of customers across industries, with an emphasis on practical application, technical precision, and process consistency.

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