Improve Semiconductor Packaging Productivity with MiCC®

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Customer Challenge

Semiconductor back-end process consists of wafer mounting, die bonding, wire bonding, and packaging. The components can get stuck to the tools during taping, cutting and bonding process, result in defects and reduced productivity.

Extend backend tools lifespan and reduce cleaning frequency with MiCC® coating

0.25 μm
Coating Material
Hardness (Gpa)
~ 20Gpa
Coating Thickness
~ 2µm

Our Solution

The MiCC® coating forms a protective layer on the backend tools’ surface with low surface energy and low friction coefficient, with smooth release. The high hardness property also allows the mould to be resistant to deformation and scratch damage during repeated cleaning process. This greatly extend tools’ lifespan, reduce cleaning frequency and improve productivity.

Test Result

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Do you have any question and want to know more about our services? We will be glad to support you.

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