ESD Coating for Semiconductor Wafers

Electrostatic discharge (ESD) coating for semiconductor wafer chucks plays a critical role in protecting sensitive devices from electrical damage during wafer handling and processing. By applying a high-performance ESD-resistant coating, manufacturers can effectively prevent charge buildup and discharge, ensuring greater process stability and yield. These coatings are specially engineered to provide uniform conductivity, thermal resistance, and mechanical durability, making them ideal for use in vacuum environments and cleanroom applications. ESD-coated wafer chucks are essential in advanced semiconductor fabrication, where precision and contamination control are paramount.

Customer Problem

In semiconductor manufacturing, ceramic components such as end effectors and electrostatic chucks are valued for their thermal stability and chemical resistance. However, customers often face challenges due to the inherent porosity and brittleness of these materials. Over time, this can lead to surface wear, microcracking, and particle generation, which compromise cleanroom standards and result in wafer contamination, equipment downtime, and yield loss. Manufacturers are increasingly seeking solutions that can enhance the durability, cleanliness, and lifespan of these critical wafer-handling components without sacrificing performance

Our Solution

NTI Nanofilm Anti-Static Discharge coating introduces a cutting-edge static dissipative solution to the semiconductor industry through a dry vacuum coating process. This innovative method enables low-temperature application on a wide range of substrates including metals, ceramics, and rubber while ensuring excellent adhesion and consistent surface resistivity.

At the core of this technology is our proprietary ta-C (tetrahedral amorphous carbon) coating, produced using NTI’s patented Filtered Cathodic Vacuum Arc (FCVA) process. With up to 88% sp³ carbon bonds our coatings deliver a diamond-like structure that provides high hardness, thermal stability, and an ultra-low friction coefficient.

Frequently Asked Questions

What is ESD coating for semiconductor wafers?

ESD (Electrostatic Discharge) coating is a specialized surface treatment applied to wafer chucks to safely dissipate static charges during semiconductor processing. It prevents electrostatic damage to wafers, ensuring yield protection and process reliability.
Why is ESD protection important for wafers?

Wafer chucks handle delicate silicon wafers during etching, deposition, and lithography. Without ESD protection, static buildup can result in uncontrolled discharges that damage wafers, reduce device performance, and lower production yields.
What materials can be coated with NTI's ESD protection coating?

NTI Nanofilm Anti-Static Discharge coating (ASD) is suitable for a variety of semiconductor tooling materials, including ceramics, metals, and elastomers. It can be applied at room temperature, making it ideal for temperature-sensitive components.
What are the requirements for wafer coatings in semiconductor processing?

Wafer chuck coatings must meet strict requirements such as ESD protection, thermal and chemical resistance, high adhesion, and low particle generation. These coatings help ensure wafer stability, prevent contamination, and maintain consistent performance in vacuum and plasma environments.
What surface resistance range does Anti-Static Discharge (ASD) coating offer?

Anti-Static Discharge (ASD) coating maintains a surface resistivity between 10⁶ and 10⁸ Ω·cm, ideal for dissipating electrostatic charges while preserving material integrity and mechanical performance.

Property	ASD
Coating Material	Ta-C + DLC
Thickness	≈ 10 nm
Coefficient of Friction vs Metal (Dry)	≈ 10⁵ Ω·cm
Coating Temperature (°C)	< 150 °C
Maximum Service Temperature (°C)	400 °C
Color	Deep Grey

ESD Coating for Semiconductor Wafers

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