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Thin-Film Coating for Next-Gen Semiconductor Manufacturing

As semiconductor devices become more advanced, manufacturers face growing challenges in precision, durability, contamination control, and cost efficiency. Traditional coatings often fall short in addressing equipment wear, electrostatic discharge (ESD), and surface degradation, leading to higher maintenance costs, reduced yield, and process inefficiencies.

NTI Nanofilm offers cutting-edge DLC (Diamond-Like Carbon) and nanocomposite coatings powered by our proprietary Filtered Cathodic Vacuum Arc (FCVA) technology. Our coatings provide exceptional hardness, ultra-low friction, superior adhesion, and enhanced thermal and chemical resistance—meeting the demanding needs of semiconductor production.

Key Applications


Benefits

  • High-Temp Resistance

    Protects lead frames during reflow/bake. Reduces sticking, cleaning cycles, and downtime.

  • Bonding Yield Protection

    Extends wire bond tool life. Improves adhesion and reduces maintenance.

  • ESD Control

    Prevents static buildup on solder ball templates for clean, precise placement

  • Wear Resistance

    Enhances lapping carrier durability. Cuts replacements and ensures wafer consistency.

  • Contamination Control

    Coats ceramic parts without metal layers. Minimizes particle shedding and wear

  • Chemical Protection

    Shields elastomer seals from plasma and corrosive gases. Extends life and chamber cleanliness.

Recommended Coatings

Properties TAC-ON® MiCC® ASD F-TAC
Coating Compositions taC CrN taC + DLC
Coating Thickness  (um) 1-4 1-4 4-6
Micro-hardness (hv) 3,000 1,800 2,500
Coefficient of Friction <0.1 <0.11 <0.1
Coating Temp (0C) 80 150 <200
Max Service Temp (0C) 500 700 400
Color Deep Grey Silver Dark Brown


Semiconductor Brochure


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Frequently Asked Questions

  • What semiconductor manufacturing challenges does NTI Nanofilm’s thin-film coatings solve?

    NTI Nanofilm’s advanced thin-film coatings address key semiconductor manufacturing challenges such as equipment wear, contamination, electrostatic discharge (ESD), and process inefficiencies. Our DLC (Diamond-Like Carbon), fluorinated coatings, and nano-crystalline coatings enhance durability, reduce defects, and extend component lifespan—ensuring higher yield, cost efficiency, and process reliability.

  • How does NTI Nanofilm’s FCVA technology improve semiconductor coating performance?

    Our proprietary Filtered Cathodic Vacuum Arc (FCVA) technology delivers ultra-dense, high-purity thin-film coatings with superior hardness, low friction, and excellent adhesion. Unlike traditional PVD or CVD coatings, FCVA produces smooth, contamination-resistant surfaces ideal for lapping carriers, wafer e-chucks, lead frames, and wire bonding tools, improving manufacturing efficiency and reducing downtime.

  • What are the benefits of TAC-ON® (ta-C) coatings in semiconductor applications?

    TAC-ON® (Tetrahedral Amorphous Carbon) coatings provide exceptional hardness, wear resistance, and ultra-low friction, extending the lifespan of critical wafer processing and packaging components. They help reduce defects, minimize contamination, and optimize semiconductor manufacturing yields, making them ideal for high-precision applications.

  • How do NTI Nanofilm’s anti-static (ASD) coatings prevent ESD-related failures in semiconductor production?

    Our ASD (Anti-Static Discharge) coatings offer customizable surface resistivity (10⁵–10⁹ Ohms/sq), protecting sensitive semiconductor tools, lead frames, and wafer carriers from electrostatic discharge damage. By preventing static buildup and particle contamination, ASD coatings enhance component reliability, yield stability, and manufacturing efficiency.

  • How can semiconductor manufacturers reduce total cost of ownership (TCO) with NTI Nanofilm’s coatings?

    NTI Nanofilm’s high-performance thin-film coatings extend equipment lifespan, reduce maintenance costs, improve process consistency, and minimize material waste. Our solutions help semiconductor manufacturers reduce total cost of ownership (TCO) by optimizing equipment performance, yield enhancement, and defect reduction, leading to higher operational efficiency and cost savings.

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