Contact Us

High Temperature Non-Stick Coating for Lead Frame Carriers

Contact Us

Carrier Release Failure Above 265 °C.

In high volume semiconductor packaging, lead frame carriers must endure extreme temperatures above 265 °C during molding and annealing. Traditional carrier coatings such as PTFE, PVD or silicone degrade rapidly in these conditions. As the coatings fail, carriers suffer sticking, warping, or tearing, causing major production interruptions. The result: increased cleaning cycles, lower yield, higher maintenance costs and reduced manufacturing efficiency.

F-TAC® coating enhances lead frame carriers with non stick surfaces, stable performance above 265 °C, and improved yield under high temperature molding in semiconductor packaging.

Property F-TAC® Coated Uncoated
Surface Behavior Clean non-stick surface with fluorinated nanofilm Adhesion and epoxy buildup during molding
Thermal Stability Stable performance above 265 °C Coating failure above 250 °C
Friction and Wear Low friction and reduced mechanical wear High friction, surface scratches
Contamination Resistant to sticking and oxidation Frequent buildup of molding resin and particles
Maintenance Frequency Longer carrier life with fewer cleaning cycles Requires frequent cleaning and replacement
Yield Impact Higher process yield and consistent carrier quality Reduced bonding consistency and yield

F-TAC® Coating Ensures Non-Stick Above 265 °C

NTI Nanofilm’s F-TAC® coating is a fluorinated non stick FCVA coating that protects lead frame carriers above 265 °C. Its smooth nanofilm resists adhesion, oxidation, and epoxy buildup, reducing cleaning, extending carrier life, improving yield, and ensuring stable, high temperature performance in semiconductor packaging.

Ready to get started?

Do you have any question and want to know more about our services? We will be glad to support you.

Contact Us

Related Pages

Frequently Asked Questions

  • Who needs F-TAC® coating?

    Semiconductor packaging and assembly lines struggling with epoxy sticking to their lead frame carriers. If you face downtime for cleaning, reduced yield from contamination, or frequent carrier replacement in high-temperature molding, this coating is for you.

  • What is the main benefit of F-TAC®?

    It eliminates epoxy adhesion. Our fluorinated nano-coating creates a permanent, non-stick surface on your carriers, ensuring clean demolding and preventing resin buildup. This directly increases production yield and reduces scrap.

  • How does F-TAC® improve my bottom line?

    By extending carrier lifespan by up to 10x and slashing maintenance downtime. This reduces your total cost of ownership and increases machine uptime, giving you more output per shift and lower consumable costs.

  • Why is F-TAC® better than PTFE or standard coatings?

    Standard PTFE coatings bake off and fail above 265°C. F-TAC®, applied with our FCVA technology, is a harder, denser PVD coating that withstands extreme heat without peeling, delivering long-lasting, consistent non-stick performance.

  • When should I apply F-TAC®?

    Apply it to new carriers before production starts or during the refurbishment of old, degraded ones. Integrating F-TAC® from the start ensures optimal performance and protects your capital investment from day one.

We use cookies on our website to see how you interact with it. By accepting, you agree to our use of such cookies. Cookie Policy