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Changzhou, China - April 16–17, 2025 Last week, industry leaders, researchers, and solar technology pioneers gathered at the 7th Perovskite & Tandem Cell Technology Forum to explore cutting-edge solutions shaping the next generation of photovoltaic innovation. Hosted by ASIACHEM in Changzhou, the forum spotlighted commercial readiness of HJT, perovskite, and tandem cell technologies and addressed urgent manufacturing […]
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As semiconductor manufacturing pushes the boundaries of miniaturization and performance, backend packaging processes must keep pace. Lead frames, thin metal structures that provide electrical connections in semiconductor packages, are a critical component in this process. To ensure precise alignment and stability during high-temperature manufacturing, lead frame carriers are used to hold them securely in place. […]
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