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As the semiconductor industry progresses, there is a clear shift towards larger wafer sizes, such as 300mm, 450mm, and beyond. This shift places increased demands on critical components in the back-end processing stages, particularly lapping carriers, which must adhere to stricter precision requirements and higher performance standards. These evolving demands underscore the lapping carrier PVD […]
Delegation of Singapore Enterprise and companies from Singapore visit Germany. Singapore government agency arranged excellent insightful meetings during the "Future of Mobility Mission" in Germany. Leading Mobility startups and established companies had been arranged for each participating Singapore company to pitch for business or collaborations. A pre-arranged tour of the International Automobile Exhibition (IAA) rounded […]
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