At Nanofilm, we are always driven to create a positive impact to the community.
The Growing Challenge of Ultrasonic Wedge Bonding Ultrasonic wedge bonding is a cornerstone of semiconductor packaging, power electronics, and microelectronics assembly. It connects fine wires, often aluminum (Al) or copper (Cu), to device bond pads using ultrasonic vibration, mechanical pressure, and heat. This process is fast and reliable but comes with significant operational challenges. The […]
We use cookies on our website to see how you interact with it. By accepting, you agree to our use of such cookies. Cookie Policy