As semiconductor devices continue to shrink in size and grow in complexity, driven by applications in artificial intelligence, edge computing, and wearable technology, packaging technologies must keep pace. Three dimensional integration and advanced architectures now require finer wires and smaller bond pads, increasing mechanical stress on bonding tools. While flip chip methods are used in […]
Fuel Efficiency: A Top Priority for Maritime Operators In the global shipping industry, fuel accounts for over 50% of a vessel’s operating costs , making energy efficiency a top priority for shipowners and operators. As environmental regulations tighten and fuel prices remain volatile, improving engine performance has become a critical pathway to reducing both emissions and […]
Over two days in Shanghai, the NTI Nanofilm Technology Forum 2026 brought together more than 120 participants from across NTI’s global network, alongside the NTI-NTU Corporate Laboratory team, for a shared purpose: to connect research, engineering, and business more closely with the needs of industry. This year’s forum was framed by the theme “One LEAP” […]
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