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Tool Wear to Maximize Wire Bonding Efficiency
Tool wear in wire bonding remains a major productivity challenge raising costs and disrupting yield. Learn how our coating enhances hardness, durability, and consistency, extending capillary life and reducing tool changes for higher throughput and long-term reliability.
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Tackling Ultrasonic Wedge Bonding’s High Temperature and Wear
As semiconductor packaging advances toward Cu wedge bonding and higher integration, bonding tools face escalating thermal and mechanical stress. Learn how coating that delivers exceptional hardness, thermal stability, ultra-low friction, and uniform solder behavior.