Nanofilm Latest News

30 Apr 2025

NTI Nanofilm Shares Deep Tech Scale-Up Journey at US-Singapore Workshop on Innovation and Partnerships

Singapore — April 14–17, 2025 — The US-Singapore Workshop on Deep Tech Innovation and Partnerships convened leading voices from government, academia, venture capital, and industry to explore how cross-border collaboration can accelerate the development of cutting-edge technologies. Held in Singapore and supported by the US National Science Foundation (NSF), Northeastern University’s Institute for NanoSystems Innovation (NanoSI), […]

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Corporate

NTI Nanofilm Shares Deep Tech Scale-Up Journey at US-Singapore Workshop on Innovation and Partnerships

21 Apr 2025

NTI Nanofilm Showcases Scalable CSS Technology for Perovskite Solar Cells at the 7th Perovskite & Tandem Cell Technology Forum 2025

Changzhou, China - April 16–17, 2025 Last week, industry leaders, researchers, and solar technology pioneers gathered at the 7th Perovskite & Tandem Cell Technology Forum to explore cutting-edge solutions shaping the next generation of photovoltaic innovation. Hosted by ASIACHEM in Changzhou, the forum spotlighted commercial readiness of HJT, perovskite, and tandem cell technologies and addressed urgent manufacturing […]

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Corporate

NTI Nanofilm Showcases Scalable CSS Technology for Perovskite Solar Cells at the 7th Perovskite & Tandem Cell Technology Forum 2025

04 Apr 2025

NTI Nanofilm Technology Forum: A Gathering of Minds to Shape the Future

Last week, NTI Nanofilm hosted its annual Technology Forum, bringing together over 100 participants across Asia and Europe in a hybrid format to discuss, innovate, and reflect on the past year's achievements. What started as an initiative by our Founder and Group CEO, Dr. Shi Xu, has now evolved into a key event that fosters […]

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Corporate

NTI Nanofilm Technology Forum: A Gathering of Minds to Shape the Future

21 Mar 2025

How to Increase Reliability in Lead Frame Carriers at High Temperatures (>265°C)

As semiconductor manufacturing pushes the boundaries of miniaturization and performance, backend packaging processes must keep pace. Lead frames, thin metal structures that provide electrical connections in semiconductor packages, are a critical component in this process. To ensure precise alignment and stability during high-temperature manufacturing, lead frame carriers are used to hold them securely in place. […]

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Product

How to Increase Reliability in Lead Frame Carriers at High Temperatures (>265°C)

05 Mar 2025

Overcoming 4 Key PVD & PECVD Coating Challenges and Optimize Lapping Carrier Performance in Semiconductor Backend Manufacturing

As the semiconductor industry progresses, there is a clear shift towards larger wafer sizes, such as 300mm, 450mm, and beyond. This shift places increased demands on critical components in the back-end processing stages, particularly lapping carriers, which must adhere to stricter precision requirements and higher performance standards. These evolving demands underscore the lapping carrier PVD […]

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Product

Overcoming 4 Key PVD & PECVD Coating Challenges and Optimize Lapping Carrier Performance in Semiconductor Backend Manufacturing

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Latest News

NTI Nanofilm Shares Deep Tech Scale-Up Journey at US-Singapore Workshop on Innovation and Partnerships

NTI Nanofilm Showcases Scalable CSS Technology for Perovskite Solar Cells at the 7th Perovskite & Tandem Cell Technology Forum 2025

NTI Nanofilm Technology Forum: A Gathering of Minds to Shape the Future

How to Increase Reliability in Lead Frame Carriers at High Temperatures (>265°C)

Overcoming 4 Key PVD & PECVD Coating Challenges and Optimize Lapping Carrier Performance in Semiconductor Backend Manufacturing

News and Announcements

NTI Nanofilm Shares Deep Tech Scale-Up Journey at US-Singapore Workshop on Innovation and Partnerships

NTI Nanofilm Showcases Scalable CSS Technology for Perovskite Solar Cells at the 7th Perovskite & Tandem Cell Technology Forum 2025

NTI Nanofilm Technology Forum: A Gathering of Minds to Shape the Future

How to Increase Reliability in Lead Frame Carriers at High Temperatures (>265°C)

Overcoming 4 Key PVD & PECVD Coating Challenges and Optimize Lapping Carrier Performance in Semiconductor Backend Manufacturing

Financial Statements and Related Announcement:Full Yearly Results